Selective metallization process, additive method for manufacturi

Details Selective metallization process, additive method for manufacturi Selective metallization process, additive method for manufacturi

1987-11-10

1990-01-30

Morris, Theodore

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

10628711, C25D 534

Patent

active

048971189

ABSTRACT:
A process for selective metallization of a substrate in a predetermined desired pattern, and particularly for the manufacture of printed circuit boards, in which a substrate patterned in desired manner with resist material is treated with conditioning agent, adjuvant and deactivating agent preparatory to catalytic activation and electroless deposit of metal flash. By proceeding in this manner, adherent flash metal deposit is achieved on non-resist areas without encountering significant plating on resist areas. Following metal flash deposit, the resist can be easily and cleanly stripped and additional metal then built up on the flash metal.

REFERENCES:
patent: 3175921 (1965-03-01), Hedlund
patent: 3306759 (1967-02-01), Steinbach
patent: 4248632 (1981-02-01), Ehrich et al.
patent: 4575527 (1986-03-01), Dixon et al.
patent: 4590129 (1986-05-01), Kaschig et al.
patent: 4612055 (1986-09-01), Manis et al.
patent: 4748104 (1988-05-01), Ferrier et al.

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