Selective metallization process

Details Selective metallization process Selective metallization process

1995-08-29

1996-04-23

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaged product

Deposited metal coating on image

430 9, 430 11, 430 17, G03F 716

Patent

active

055102166

ABSTRACT:
The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.

REFERENCES:
patent: 5079600 (1992-01-01), Schnur et al.
patent: 5158860 (1992-10-01), Gulla et al.
patent: 5233067 (1993-08-01), Swei et al.

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