Selective metallization process

Details Selective metallization process Selective metallization process

1984-04-16

1985-08-27

Lawrence, Evan K.

Coating processes

Nonuniform coating

Applying superposed diverse coatings or coating a coated base

427 98, 427306, 427307, B05D 512, B05D 132, B05D 310

Patent

active

045377995

ABSTRACT:
A selective metallization process particularly suited for making printed circuit boards comprises the step of treating a substrate having a negative mask thereon with a reactant, e.g., acetic acid, which modifies the surface of the mask without affecting the substrate so as to remove or prevent an active catalytic layer from remaining on the surface of the mask thereby preventing electroless plating on the mask.

REFERENCES:
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patent: 3929483 (1975-12-01), Wainer et al.
patent: 4151313 (1979-04-01), Wajima et al.
patent: 4224118 (1980-09-01), Hans
patent: 4268349 (1981-05-01), Hacke et al.
patent: 4270985 (1981-06-01), Lipson et al.
patent: 4297175 (1981-10-01), Schlegel et al.
patent: 4388351 (1983-06-01), Sawyer

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