Selective metal plating onto poly(phenylene sulfide) substrates

Coating processes – Electrical product produced – Welding electrode

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204 15, 204 38B, 427 98, 427316, 427304, 427305, 427306, 427307, 427404, C23C 302

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044864639

ABSTRACT:
A method for selectively plating metal, such as copper, onto poly(phenylene sulfide) substrates is disclosed. In this method, a crystalline region and an amorphous region are created in a substrate. One method for creating these regions is to selectively crystallize a region in an amorphous poly(phenylene sulfide) substrate by heating it above its glass transition temperature. The surface of the substrate is then activated with an electroless plating catalyst such as palladium metal. After activation, a nitrosyl salt is introduced into the amorphous region of the substrate. The substrate is then immersed in an electroless plating solution containing the metal ions whereby metal selectively plates onto the crystalline region of the substrate.

REFERENCES:
patent: 4239789 (1980-12-01), Blum
patent: 4440801 (1984-04-01), Aviram
patent: 4447471 (1984-05-01), Pott
Rubner, M., Cukor, P., Jopson, H., and Deits, Walter, "Electrically Conducting Poly(para-Phenylene Sulfide) Prepared by Doping with Nitrosyl Salts from Solution", Journal of Electronic Materials, vol. 11, No. 2, Mar. 1982.
Domino, F. A., "Plating of Plastics--Recent Developments", Chemical Technology Review No. 138, pp. 112-116, Noyes Data Corp., New Jersey, (1979).
U.S. Ser. No. 391,199 filed 6/23/82, Rubner et al.
Feldstein, "Selective Electroless Plating Techniques: A Survey", Plating, Aug. 1970.

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