Selective laser removal of dielectric coating

Details Selective laser removal of dielectric coating Selective laser removal of dielectric coating

1998-09-22

2000-05-09

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

21912183, B23K 2600

Patent

active

060606835

ABSTRACT:
A process for selectively removing a dielectric layer from a portion of a panel to create a coated and an uncoated region, the process including (a) applying a laser-termination bead on the panel to separate a first region corresponding to the coated region from a second region corresponding to the uncoated region; (b) applying a dielectric coating over the panel and the laser-termination bead; (c) cutting the dielectric layer along the laser-termination bead with a laser beam; and (d) peeling away the dielectric layer from the second region. The panel may be a direct radiography panel; the dielectric layer may be a polymer such as parylene; the laser-termination bead may be an epoxy; and/or the laser may be an excimer laser.

REFERENCES:
patent: 5099101 (1992-03-01), Millerick et al.
patent: 5381014 (1995-01-01), Jeromin et al.
patent: 5648660 (1997-07-01), Lee et al.
patent: 5961860 (1999-10-01), Lu et al.

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