Metal fusion bonding – Process – Plural joints
Patent
1991-08-12
1993-01-05
Seidel, Richard K.
Metal fusion bonding
Process
Plural joints
228260, B23K 3102
Patent
active
051763125
ABSTRACT:
A soldering apparatus for selectively soldering designated areas on the surface of a printed circuit (PC) board for mounting multi-pin, through hole circuit components thereto includes a wave solder pot, a fixture for receiving and positioning the PC board over the solder pot, and a plurality of spaced nozzles disposed adjacent a lower surface, i.e., solder side, of the PC board. When actuated, the apparatus directs a solder flow through the nozzles to designated areas corresponding to the location of various components on the PC board. Each nozzle is configured and positioned to match the location and pin pattern of components to be soldered on the PC board for applying solder only to the local area, not affecting adjacent parts, and minimizing the amount of solder applied as well as limiting the temperatures to which the PC board is subjected. The apparatus may be used with either a foam or wave flux application to selected areas of the PC board. A preheater may be included to warm the PC board prior to selective soldering to inhibit board damage. A slide conveyor may be used to transport the PC board on the "X" axis and also permit controlled movement on the "Z" axis to a predetermined height.
REFERENCES:
patent: 2870532 (1959-01-01), Young
patent: 4030717 (1977-06-01), Serlovsky
patent: 4412641 (1983-11-01), Fuchs et al.
patent: 4506820 (1985-03-01), Brucker
patent: 4530458 (1985-07-01), Kondo
patent: 4540114 (1985-09-01), Pachschwoll
patent: 4602730 (1986-07-01), Murakami et al.
patent: 4632291 (1986-12-01), Rahn
patent: 4659002 (1987-04-01), Wallgren et al.
patent: 4700878 (1987-10-01), Ciniglio
patent: 4739919 (1988-04-01), Van Den Brekel et al.
patent: 4807794 (1989-02-01), Hess
patent: 4887762 (1989-12-01), Baker
patent: 4890781 (1990-01-01), Johnson et al.
patent: 4932585 (1990-06-01), Nakamura
patent: 4942997 (1990-07-01), Sinkunas et al.
patent: 4981248 (1991-01-01), Hall
Miner James
Seidel Richard K.
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