Selective etching of substrates with control of the etch...

Compositions – Etching or brightening compositions

Reexamination Certificate

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C252S079400, C438S745000

Reexamination Certificate

active

07041232

ABSTRACT:
A wet etching system for selectively patterning substrates having regions covered with self-assembled monolayers (SAM) thereby controlling the etch profile. The system contains a) a liquid etching solution; and b) at least one additive to the liquid etching solution having a higher affinity to the regions of the substrate covered with the SAMs than to the other regions of the substrate. Also provided is a method of selectively patterning substrates having regions covered with self-assembled monolayers (SAMs), thereby controlling the etch profile, the method consisting of the steps of a) providing a liquid etching solution; b) adding at least one additive to said etching solution having a higher affinity to the regions of the substrate covered with the SAMs than to the other regions of the substrate; and c) etching said substrate with said liquid etching solution containing at least one additive.

REFERENCES:
patent: 5292445 (1994-03-01), Fjare et al.
patent: 5885753 (1999-03-01), Crooks et al.
patent: 6060256 (2000-05-01), Everhart et al.
patent: 6114099 (2000-09-01), Liu et al.

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