Selective epitaxial growth of gallium arsenide with selective or

Metal working – Method of mechanical manufacture – Assembling or joining

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29576W, 29578, 29580, 29591, 148175, 156612, 156647, 156648, 156653, 156657, 1566591, 427 84, 357 15, 357 59, 357 50, 357 56, H01L 2120, H01L 21302, H01L 2176

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044675216

ABSTRACT:
A method of fabricating semiconductor devices on semi-insulating GaAs substrates is provided. Pre-etched holes in the substrate are covered with a dielectric which is etched to expose the substrate only at the bottom of the holes. Epitaxial growth of active GaAs in the holes may then proceed with a single crystallographic orientation. The dielectric covering the sidewalls of the holes prevents unwanted random growth and poor surface morphology of the active area.

REFERENCES:
patent: 3403439 (1968-10-01), Bailey
patent: 3425879 (1969-02-01), Shaw et al.
patent: 3578515 (1971-05-01), Borrello et al.
patent: 3808470 (1974-04-01), Kniepkamp
patent: 4316201 (1982-02-01), Christou et al.
Shaw, D. W., "Selective Epitaxial Deposition of Gallium Arsenide in Holes", J. Electrochem. Soc., vol. 113, No. 9, Sep. 1966, pp. 904-908.
Yang et al., "Selective Epitaxial Growth of GaAs by Liquid Phase Epitaxy", J. Electrochem. Soc., vol. 129, No. 1, Jan. 1982, pp. 194-197.
Broadie et al., "Selective Planar GaP/Si Deposition . . . Diodes", IBM Tech. Discl. Bull., vol. 16, No. 4, Sep. 1973, p. 1301.
French, W. B., "Technique for Reducing Surface Leakage . . . Devices", RCA Tech. Note No. 919, (2 pages), Oct. 25, 1972.

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