Selective electroplating apparatus and method of using same

Chemistry: electrical and wave energy – Processes and products

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C25D 704

Patent

active

049311506

ABSTRACT:
An electroplating apparatus for rapidly depositing a metal onto a selected surface of a workpiece, which apparatus comprises an anode having an active surface with a selected shape to combine with the selected surface of the workpiece to define an elongated gap of at least about 0.050 inches, means for supporting this anode in a fixed position to define the elongated gap; solution circulating means for forcing an electroplating solution with metal cations through the gap in a generally closed path at a velocity to exchange electroplating solution in the gap at a rate of at least 25 times per minute; and, means for applying current flow between the selected workpiece surface and the active surface of the anode through the gap at a current density in excess of 2.0 amperes/in.sup.2. The invention also involves the method of using this apparatus to rapidly deposit metal, such as nickel, onto the inner cylindrical surface of a bore on a complex part such as an aircraft landing gear forging.

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