Selective electroplating

Chemistry: electrical and wave energy – Processes and products

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Details

204224R, C25D 506, C25D 1714, C25D 1728

Patent

active

042205042

ABSTRACT:
A method for electroplating a selective area of a part is disclosed comprising the steps of rotating a disc having an absorbent upper surface, maintaining electrolytic solution on the absorbent upper surface of the disc. While such disc is charged anodically and the part is charged cathodically, the part is passed across a chord of the circle within which the disc rotates with the selective area of the part in contact with the electrolytic solution on the rotating disc.

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Materials and Methods, vol. 40, No. 6, 1954, Brush Plating Now Practical, M. Rubinstein.
Technical Proceedings of the 43rd Annual Convention of the American Electroplater's Society, pp. 246-255, 1956.
Gold Plating Technology by Frank H. Reid et al., 1974, pp. 181-201.

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