Selective electroless plating process for metal conductors

Details Selective electroless plating process for metal conductors Selective electroless plating process for metal conductors

1991-03-11

1992-12-01

Beck, Shrive

Coating processes

Immersion or partial immersion

Metal base

427306, 427307, 427 98, C23C 2600

Patent

active

051679922

ABSTRACT:
A method for electrolessly plating an overcoat metal on a metal conductor disposed on a dielectric surface of a substrate. The method includes removing carbonized film from the dielectric surface by applying a plasma discharge, acid treating the metal conductor by dipping the substrate in a first acid solution in order to clean the surface of the metal conductor, activating the metal conductor to allow electroless plating thereon by dipping the substrate in a metal activator solution, deactivating the dielectric surface to prevent electroless plating thereon without deactivating the metal conductor by dipping the substrate in a second acid solution, and plating an overcoat metal on the metal conductor by dipping the substrate in an electroless plating solution so that the overcoat metal plates on and coats the metal conductor without plating on the dielectric surface.

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