Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1992-04-13
1993-02-23
Tufariello, T. M.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C25D 502
Patent
active
051887231
ABSTRACT:
A process for selectively electrodepositing a pattern of metal such as copper on a substrate comprises the deposition of two successive layers over the entire substrate, photolithographic patterning of the upper layer, and placement of the exposed part of the first deposited layer to a lower surface potential then the patterned second layer. The metal is then deposited under a periodical modulated voltage signal that is adjusted in reference to the reduction potential of the metal so that any metal deposited on the exposed part of the first layer during the positive duty cycle of the signal is removed during the negative duty cycle while little or none of the metal deposited on the second layer is removed due to the second layer higher surface potential. The remaining exposed part of the first layer is etched away after the electrodeposition process is terminated.
REFERENCES:
patent: 4988412 (1991-01-01), Liu
Gilton Terry
Sandhu Gurtej S.
Yu Chris C.
Charmasson Henri J. A.
Micro)n Technology, Inc.
Tufariello T. M.
LandOfFree
Selective electro-deposition and circuit patterning technique does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Selective electro-deposition and circuit patterning technique, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Selective electro-deposition and circuit patterning technique will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2202347