Selective deposition of copper

Details Selective deposition of copper Selective deposition of copper

1984-11-19

1986-03-04

Lusignan, Michael R.

Coating processes

Electrical product produced

Welding electrode

427 89, 427 91, 427 92, 427124, 427125, 427250, 427252, 427305, B05D 306, B05D 512

Patent

active

045740950

ABSTRACT:
A process for selectively depositing copper by first selectively depositing palladium seeds by irradiating a palladium compound with light. Following the deposition of the palladium seeds, copper is deposited by an electroless process.

REFERENCES:
patent: 4259409 (1981-03-01), Arnold
patent: 4340617 (1982-07-01), Deutsch et al.
patent: 4420365 (1983-12-01), Lehren
patent: 4472513 (1984-09-01), Hammond et al.
patent: 4486463 (1984-12-01), Rubner et al.
patent: 4495255 (1985-01-01), Draper et al.
Karlicek, R. F. et al., Laser-Induced Metal Deposition on InP, J. Appl. Phys. 53(2), Feb. 1982.

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