Selective copper deposition method

Details Selective copper deposition method Selective copper deposition method

1997-07-03

1999-11-16

Mayrkar, Kishor

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205184, 205194, 204231, C25D 502

Patent

active

059851252

ABSTRACT:
A selective copper deposition method, comprising the steps of: forming barrier metal patterns on a wafer; and depositing copper only on the barrier metal patterns by electrochemistry, by which high pure copper film patterns can be formed simultaneously with deposition of copper, with ease.

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H.M. Dalal et al., "A Dual Damascene Hard Metal Capped Cu and Al-Alloy for Interconnect Wiring of ULSI Circuits", 1993 IEEE IEDM 93-273, pp. 11.4.1-11.4.4 (no month available).

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