Selective chemical-mechanical polishing properties of a...

Details Selective chemical-mechanical polishing properties of a... Selective chemical-mechanical polishing properties of a...

2005-01-25

2005-01-25

Hail, III, Joseph J. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S060000, C451S285000, C451S290000, C521S092000, C521S134000, C204S157970, C204S157970

Reexamination Certificate

active

06846225

ABSTRACT:
The present invention is directed, in general, to a method of polishing a surface on substrates, such as semiconductor wafers and, more specifically, to a polishing pad suitable for this purpose. The polishing pad comprises a polishing body that includes a cross-linked polymer material, and may be incorporated into a polishing apparatus. Polishing includes positioning the substrate containing at least one layer against the polishing body and polishing the layer.

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