Selective catalytic activation of non-conductive substrates

Details Selective catalytic activation of non-conductive substrates Selective catalytic activation of non-conductive substrates

2007-08-14

2007-08-14

Nguyen, Nam (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

C205S118000, C205S187000, C427S098100, C427S098200, C427S098400

Reexamination Certificate

active

10837109

ABSTRACT:
A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles and for creating circuitry for smart cards, such as phone cards is provided. The method comprises the steps of catalyzing the non-conductive substrate by applying a catalytic ink, reducing a source of catalytic metal ions in the catalytic ink to its associated metal, depositing electroless metal on the pattern of catalytic ink on the surface of the substrate; and plating electrolytic metal on the electroless metal layer to produce the desired pattern of metal on the non-conductive substrate. The catalytic ink typically comprises one or more solvents, a source of catalytic metal ions, a crosslinking agent, one or more copolymers, a polyurethane polymer, and, optionally, one or more fillers.

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