Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1984-07-02
1986-12-02
Kimlin, Edward
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156292, 156290, 29830, 428138, 428133, B32B 3104, B32B 3112
Patent
active
046263098
ABSTRACT:
An interconnection mask which is sandwiched between two members to be bonded together is comprised of a thin sheet of preselected material which has a plurality of apertures therein which are positioned, sized, and shaped to define the common bonding areas between the two members whereby structural failures induced by bonding and loading characteristics of the two members are minimized. A method for making an apparatus which utilizes the interconnection mask comprises the steps of preparing a mask of preselected material having a plurality of apertures therein, each aperture being positioned, sized and shaped to define a common bonding area between first and second members of the apparatus whereby the structural failures induced by the bonding and loading characteristics of the two members are minimized; placing a layer of bonding material on a surface of the first member; placing the interconnection mask over the layer of bonding material; placing the second member over the mask; bonding the first and second members together at each common bonding area defined by the apertures in the mask.
REFERENCES:
patent: 3411205 (1968-11-01), McGinley
patent: 3789470 (1974-02-01), Owaki et al.
patent: 3972755 (1976-08-01), Misfeldt
patent: 4037047 (1977-07-01), Taylor
patent: 4088805 (1973-05-01), Wiegand
patent: 4339303 (1982-07-01), Frisch et al.
patent: 4404059 (1983-09-01), Livshits et al.
patent: 4421811 (1983-12-01), Rose et al.
patent: 4446188 (1984-05-01), Patel et al.
patent: 4457796 (1984-07-01), Needham
patent: 4496793 (1985-01-01), Hanson et al.
Electronics, "Epoxy Called Better Than Conventional Solder for Surface-Mounting Components on Board", May 31, 1984, p. 46.
Grotelueschen James H.
Henschel Robert
Mullen, III William B.
Downey Joseph T.
Hoch Ramon R.
Kahler Mark P.
Kimlin Edward
Motorola Inc.
LandOfFree
Selective bonding interconnection mask does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Selective bonding interconnection mask, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Selective bonding interconnection mask will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2291131