Selective application of conductive material to circuit...

Details Selective application of conductive material to circuit... Selective application of conductive material to circuit...

2006-02-07

2006-02-07

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S615000, C428S617000, C257S779000, C361S751000, C361S808000

Reexamination Certificate

active

06994918

ABSTRACT:
A component for use in manufacturing circuit boards, such as printed circuit boards, or flex substrates is adapted for use with pick-and-place equipment to provide a first material overlay disposed over a second material base layer. Such a component may include a first electrically conductive material disposed over a second electrically conductive material, and a soluble tape backing disposed over and attached to the second electrically conductive material. The component may be attached to a circuit board by solder relow, after which the soluble tape backing is removed. Although typical embodiments involve electrically conductive materials, it is noted that an electrically insulating material can also be disposed over and attached to an underlying material which itself is disposed on a circuit board.

REFERENCES:
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patent: 5829124 (1998-11-01), Kresge et al.
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patent: 6331347 (2001-12-01), Haji
patent: 6359233 (2002-03-01), Joy et al.
patent: 6841228 (2005-01-01), Edwards et al.

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