Selective application of adhesive and bonding process for ink je

Details Selective application of adhesive and bonding process for ink je Selective application of adhesive and bonding process for ink je

1986-07-02

1987-07-07

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156235, 156254, 346 11, B32B 3100

Patent

active

046785299

ABSTRACT:
A method of bonding ink jet printhead components together by coating a flexible substrate with a relatively thin, uniform layer of an adhesive having an intermediate non-tacky curing stage with a shelf life with around one month for ease of alignment of the parts and ease of storage of the components having the adhesive thereon. Transferring about half of the adhesive layer on the flexible substrate to the high points or lands of one of the printhead components within a predetermined time of the coating of the flexible substrate by placing it in contact therewith and applying a predetermined temperature and pressure to the flexible substrate prior to peeling it from the printhead component. This causes the adhesive to fail cohesively in the liquid state, assuring that about half of the thickness of the adhesive layer stays with the flexible substrate and is discarded therewith, leaving a very thin uniform layer of adhesive on the printhead component lands. The transferred adhesive layer remaining on the printhead component enters an intermediate non-tacky curing stage to assist in subsequent alignment of the printhead components. The printhead components are aligned and the adhesive layer cured to complete fabrication of the printhead.

REFERENCES:
patent: 3089800 (1963-05-01), Colfer et al.
patent: 4017581 (1977-04-01), Amidon
patent: 4027345 (1977-06-01), Fujisawa et al.
patent: 4147579 (1979-04-01), Schade
patent: 4284457 (1981-08-01), Stonier
patent: 4465538 (1984-08-01), Schmoock
patent: 4601777 (1986-07-01), Hawkins et al.

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