Selective addition of a solder ball to an array of solder balls

Details Selective addition of a solder ball to an array of solder balls Selective addition of a solder ball to an array of solder balls

1994-08-10

1995-06-20

Heinrich, Samuel M.

Metal fusion bonding

Process

Using high frequency vibratory energy

228254, 228 11, 228 41, H01L 21607

Patent

active

054254930

ABSTRACT:
A specially designed tip containing an electron discharge milled cone of specific dimensions is used to transfer a critical solder volume from a solder ball carrier to a specific solder ball site on the base line metal on a high density chip, substrate terminal connection, solder ball connection, or any solder ball array. The critical tip/cone dimensions have a height of the cone and a circumference at the base which generate a specific volume of solder to be transferred.

REFERENCES:
patent: 4139140 (1979-02-01), Stockel
patent: 5058798 (1991-10-01), Yamazaki et al.
patent: 5118370 (1992-06-01), Ozawa

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