Selecting groups of dies for wafer testing

Details Selecting groups of dies for wafer testing Selecting groups of dies for wafer testing

2007-02-20

2007-02-20

Pert, Evan (Department: 2826)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C438S017000

Reexamination Certificate

active

11214088

ABSTRACT:
Integrated circuit die on wafer are tested individually, without probing any of the die, using circuitry (TC1–8, BC1–8, LR1–8, RR1–8, PA1–PA4) provided on the wafer.

REFERENCES:
patent: 4956602 (1990-09-01), Parrish
patent: 5736850 (1998-04-01), Legal
patent: 6046600 (2000-04-01), Whetsel
patent: 6954080 (2005-10-01), Whetsel

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