Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-05-08
2007-05-08
Metjahic, Safet (Department: 2858)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S761010, C324S765010
Reexamination Certificate
active
09327116
ABSTRACT:
A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.
REFERENCES:
patent: 3379937 (1968-04-01), Shepherd et al.
patent: 3702982 (1972-11-01), Kelley et al.
patent: 3781683 (1973-12-01), Freed
patent: 3849728 (1974-11-01), Evans
patent: 3963986 (1976-06-01), Morton et al.
patent: 4032058 (1977-06-01), Riseman
patent: 4087747 (1978-05-01), Deegen et al.
patent: 4357062 (1982-11-01), Everett
patent: 4508405 (1985-04-01), Damon et al.
patent: 4522893 (1985-06-01), Bohlen et al.
patent: 4528500 (1985-07-01), Lightbody et al.
patent: 4553192 (1985-11-01), Babuka et al.
patent: 4565314 (1986-01-01), Scholz
patent: 4636722 (1987-01-01), Ardezzone
patent: 4724383 (1988-02-01), Hart
patent: 4740410 (1988-04-01), Muller et al.
patent: 4811081 (1989-03-01), Lyden
patent: 4837622 (1989-06-01), Whann et al.
patent: 4899099 (1990-02-01), Mendenhall et al.
patent: 4899106 (1990-02-01), Ogura
patent: 4918032 (1990-04-01), Jain et al.
patent: 4953834 (1990-09-01), Ebert et al.
patent: 4965865 (1990-10-01), Trenary
patent: 4972580 (1990-11-01), Nakamura
patent: 4983907 (1991-01-01), Crowley
patent: 4998885 (1991-03-01), Beaman
patent: 5172050 (1992-12-01), Swapp
patent: 5175491 (1992-12-01), Ewers
patent: 5187020 (1993-02-01), Kwon et al.
patent: 5191708 (1993-03-01), Kasukabe et al.
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5225777 (1993-07-01), Bross et al.
patent: 5236118 (1993-08-01), Bower et al.
patent: 5276395 (1994-01-01), Malloy
patent: 5278442 (1994-01-01), Prinz et al.
patent: 5311405 (1994-05-01), Tribbey et al.
patent: 5312456 (1994-05-01), Reed et al.
patent: 5373627 (1994-12-01), Grebe
patent: 5393375 (1995-02-01), MacDonald et al.
patent: 5395253 (1995-03-01), Crumly
patent: 5418471 (1995-05-01), Kardos
patent: 5422574 (1995-06-01), Kister
patent: 5440231 (1995-08-01), Sugai
patent: 5473510 (1995-12-01), Dozier, II
patent: 5476211 (1995-12-01), Khandros
patent: 5476818 (1995-12-01), Yanof et al.
patent: 5477160 (1995-12-01), Love
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5534784 (1996-07-01), Lum
patent: 5555422 (1996-09-01), Nakano
patent: 5569272 (1996-10-01), Reed
patent: 5576630 (1996-11-01), Fujita
patent: 5593322 (1997-01-01), Swamy et al.
patent: 5601740 (1997-02-01), Eldridge et al.
patent: 5657207 (1997-08-01), Schreiber et al.
patent: 5691650 (1997-11-01), Sugai
patent: 5741144 (1998-04-01), Elco et al.
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5786701 (1998-07-01), Pedder
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5821763 (1998-10-01), Beaman et al.
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 5832601 (1998-11-01), Eldridge et al.
patent: 5864946 (1999-02-01), Eldridge et al.
patent: 5914614 (1999-06-01), Beaman et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5920200 (1999-07-01), Pendse et al.
patent: 5923178 (1999-07-01), Higgins et al.
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 5994152 (1999-11-01), Khandros et al.
patent: 5998864 (1999-12-01), Khandros et al.
patent: 6008543 (1999-12-01), Iwabuchi
patent: 6029344 (2000-02-01), Khandros et al.
patent: 6050829 (2000-04-01), Eldridge et al.
patent: 6053395 (2000-04-01), Sasaki
patent: 6064213 (2000-05-01), Khandros et al.
patent: 6110823 (2000-08-01), Eldridge et al.
patent: 6174744 (2001-01-01), Watanabe et al.
patent: 6229324 (2001-05-01), Akram et al.
patent: 4237591 (1994-11-01), None
patent: 19610123 (1997-10-01), None
patent: 61615 (1982-10-01), None
patent: 369112 (1990-05-01), None
patent: 0460822 (1991-12-01), None
patent: 54-146581 (1979-11-01), None
patent: 63-268285 (1988-11-01), None
patent: 2144869 (1990-06-01), None
patent: 6265575 (1994-09-01), None
patent: WO 97/12706 (1991-08-01), None
patent: WO 96/15458 (1996-05-01), None
patent: WO96/38858 (1996-12-01), None
patent: WO 97/43653 (1997-11-01), None
patent: WO97/43656 (1997-11-01), None
patent: WO 98/21597 (1998-05-01), None
Koji Soejima, Mitsuru Kimura, Yuzo Shimada, Shintaro Aoyama, “New Probe Microstructure For Full-Wafer Contact-Probe Cards”, 1999 IEEE, 1999 Electronic Components and Technology Conference, 6 pages.
U.S. application No. 196,924, filed Nov. 19, 1998, Khandros et al., Method of Fabricating a Large Contactor with Multiple, Aligned Contactor Units.
WO 97/43656, Nov. 20, 1997, PCT, Published Patent Application, entitled “Wafer-Level Burn-In and Test”.
WO 96/38858, Dec. 5, 1996, PCT, Published Patent Application, entitled “Contact Carriers (Tiles) for Populating Larger Substrates with Spring Contacts”.
Koji Soejima, et al. “New Probe Microstructure for Full-Wafer Contact-Probe Cards,” 1999 IEEE, 1999 Electronic Components and Technology Conference, 6 pages.
U.S. application No. 08/196,924, filed Nov. 19, 1998, by Khandros, et al., titled “Method Of Fabricating A Large Contactor With Multiple, Aligned Contactor Units,” 48 pages and 14 sheets of drawings.
PCT Search Report for PCT Int'l Appln No. PCT/US00/40128, mailed Nov. 24, 2000 (8 pages).
Burbank et al, “Automatic Test Equipment Translator Board”, IBM Technical Disclosure Bulletin, vol. 21, No. 4, pp. 1404-1405, Sep. 1997.
Emsworth, “High Density Probe Assembly”, Research Disclosure 2244, No. 333, p. 33391, Jan. 1993.
Humenik, “Flexible Probe Contact”, IBM Technical Brochure, vol. 22, No. 6, p. 2286, (Nov. 1979).
Renz, U., “Multipoint Test Probe for Printed Cards”, IBM Technical Disclosure Bulletin, vol. 17, No. 2, pp. 459-460, Jul. 1974.
Renz, U., “Test Probe Contact Grid Translator Board”, IBM Technical Disclosure Bulletin, vol. 21, No. 8, pp. 3235-3236, Jan. 1979.
Cobb Harry D.
Eslamy Mohammad
Pedersen David V.
Burraston N. Kenneth
Deb Anjan K
Formfactor, Inc.
Merkadeau Stuart L.
Metjahic Safet
LandOfFree
Segmented contactor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Segmented contactor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Segmented contactor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3723617