Seeding process for electroless metal deposition

Details Seeding process for electroless metal deposition Seeding process for electroless metal deposition

1986-06-16

1987-10-20

Kittle, John E.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427305, 4273855, 427404, 430315, 430319, 430324, B05D 512, G03C 500

Patent

active

047013516

ABSTRACT:
A process for depositing and tightly binding noble metal seeds onto a substrate by coating the substrate with a very thin layer of a polymer which complexes with a noble metal compound and contacting the layer of polymer with a noble metal compound which forms a complex with the layer of polymer.

REFERENCES:
patent: 4078096 (1978-03-01), Redmond et al.
patent: 4112139 (1983-09-01), Shirk et al.
patent: 4388351 (1983-06-01), Sawyer
patent: 4517254 (1985-05-01), Grapentin et al.

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