Seed layer treatment

Details Seed layer treatment Seed layer treatment

2006-02-21

2006-02-21

Stein, Stephen (Department: 1775)

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

C427S301000, C427S304000, C427S337000, C427S377000, C205S205000, C205S223000

Reexamination Certificate

active

07001641

ABSTRACT:
Seed layer treatment to remove impurities in the seed layer that might lead to the formation of voids in interconnect circuit features. In one embodiment, the seed layer is heated in a reducing environment. In another embodiment, the seed layer is washed with a surfactant that is compatible with a surfactant used when forming the remainder of the circuit feature on the seed layer. Yet another embodiment combines both techniques.

REFERENCES:
patent: 5891513 (1999-04-01), Dubin et al.
patent: 6348410 (2002-02-01), Ngo et al.
patent: 6423200 (2002-07-01), Hymes
patent: 6472023 (2002-10-01), Wu et al.
patent: 6486560 (2002-11-01), Lopatin
patent: 2003/0075808 (2003-04-01), Inoue et al.
patent: WO 200178123 (2001-10-01), None
J.P. Lu, et al. “Understanding and Eliminating Defects in Electroplated Cu Films”, IEEE (2001) ppgs. 280-282.
Junhwan Oh, et al. “Plasma Pretreatment of the Cu Seed Layer Surface in Cu Electroplating,” Materials Chemistry and Physics 73 (2002) ppgs. 227-234.

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