Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2008-06-30
2010-11-09
Le, Thao P. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S764000
Reexamination Certificate
active
07830016
ABSTRACT:
Briefly, a memory device comprising a beta phase tungsten seed layer is disclosed.
REFERENCES:
patent: 6110826 (2000-08-01), Lou et al.
patent: 6310300 (2001-10-01), Cooney
patent: 6734097 (2004-05-01), Iggulden
patent: 7666785 (2010-02-01), Sung et al.
patent: 2006/0063025 (2006-03-01), Huang et al.
patent: 2008/0089111 (2008-04-01), Lee et al.
patent: 2008/0237798 (2008-10-01), Lee et al.
patent: 2008/0247214 (2008-10-01), Ufert
patent: 2008/0248327 (2008-10-01), Huang et al.
patent: 2009/0142925 (2009-06-01), Ha et al.
S. B. Herner, et al., “Fluorine Barrier Properties of Bias-Sputtered Tungsten Films”, Journal of The Electrochemical Society, 147 (5) pp. 1936-1939 (2000).
Blosse Alain P.
Mcteer Allen
Meldrim Mark
Cool Patent, P.C
Curtin Joseph P.
Intel Corporation
Le Thao P.
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