Seed layer compositions containing organogold and organosilver c

Details Seed layer compositions containing organogold and organosilver c Seed layer compositions containing organogold and organosilver c

1990-04-27

1991-10-22

Dixon, Jr., William R.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 118, 252514, 4271265, C23C 1808

Patent

active

050592424

ABSTRACT:
A fluid composition for producing a gold seed layer on a substrate for an electrical circuit, which comprises an organogold and an organosliver compound present as 0.5 to 10 parts by weight silver per 100 parts by weight gold. In preferred compositions the silver is present as 0.8 to 6 parts by weight per 100 parts gold. The process improves seed layer to substrate adhesion.

REFERENCES:
patent: 3313632 (1967-04-01), Langley et al.
patent: 3887383 (1975-06-01), Nesteruk
patent: 4230493 (1980-10-01), Felten

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