Seed and method for epitaxial solidification

Details Seed and method for epitaxial solidification Seed and method for epitaxial solidification

1978-12-13

1981-09-15

Clements, Gregory N.

Metal founding

Process

Shaping liquid metal against a forming surface

156DIG105, 156616R, 164127, 1641222, C30B 2102, C30B 1700

Patent

active

042895707

ABSTRACT:
A seed and method for epitaxial solidification of materials, a preferred seed having at least a portion with a melting point 20.degree.-45.degree. C. depressed from that of the alloy being solidified into an article. Boron and silicon are preferably added to nickel superalloys seeds when directionally solidified columnar grain and single crystal articles are formed. Improved seeds also have surface compositions which promote the dissolution of surface contamination films that interfere with epitaxy.

REFERENCES:
patent: 3264697 (1966-08-01), Price et al.
patent: 3494709 (1970-02-01), Piearcey
patent: 3598169 (1971-08-01), Copley
patent: 3759310 (1973-09-01), Barrow et al.
patent: 3857436 (1974-12-01), Petrov et al.
patent: 3859144 (1975-01-01), Basche et al.
patent: 4005988 (1977-02-01), Paulonis et al.
patent: 4008052 (1977-02-01), Vishnevsky et al.
patent: 4015657 (1977-04-01), Petrov et al.

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