Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-06-30
2011-11-22
Pape, Zachary M (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S697000, C361S703000, C361S679470, C361S679520, C165S104330, C165S080400, C165S080500, C257S715000, C257S719000, C257S722000, C174S015200, C174S016300, C024S453000, C024S458000, C024S459000, C024S520000
Reexamination Certificate
active
08064201
ABSTRACT:
A thermal module includes a fin assembly, a heat spreader, a heat pipe connected between the fin assembly and the heat spreader, and a securing plate. The securing plate has at least three resilient members secured on a bottom surface thereof. Each of the resilient members has a capability to deform resiliently along a direction perpendicular to the bottom surface of the securing plate to resiliently press the heat spreader to an electronic component.
REFERENCES:
patent: 7086458 (2006-08-01), Chen et al.
patent: 7697288 (2010-04-01), Okutsu
patent: 7855889 (2010-12-01), Hung et al.
patent: 2008/0068797 (2008-03-01), Iikubo
patent: 2009/0201646 (2009-08-01), Yang et al.
patent: 2010/0296251 (2010-11-01), Chen et al.
Kuo Po-Hsuan
Lin Chih-Hsun
Altis Law Group, Inc.
Foxconn Technology Co., Ltd.
Pape Zachary M
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