Securing device and thermal module incorporating the same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S697000, C361S703000, C361S679470, C361S679520, C165S104330, C165S080400, C165S080500, C257S715000, C257S719000, C257S722000, C174S015200, C174S016300, C024S453000, C024S458000, C024S459000, C024S520000

Reexamination Certificate

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08064201

ABSTRACT:
A thermal module includes a fin assembly, a heat spreader, a heat pipe connected between the fin assembly and the heat spreader, and a securing plate. The securing plate has at least three resilient members secured on a bottom surface thereof. Each of the resilient members has a capability to deform resiliently along a direction perpendicular to the bottom surface of the securing plate to resiliently press the heat spreader to an electronic component.

REFERENCES:
patent: 7086458 (2006-08-01), Chen et al.
patent: 7697288 (2010-04-01), Okutsu
patent: 7855889 (2010-12-01), Hung et al.
patent: 2008/0068797 (2008-03-01), Iikubo
patent: 2009/0201646 (2009-08-01), Yang et al.
patent: 2010/0296251 (2010-11-01), Chen et al.

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