Secure physical connections formed by a kinetic spray process

Details Secure physical connections formed by a kinetic spray process Secure physical connections formed by a kinetic spray process

2011-03-08

2011-03-08

King, Roy (Department: 1733)

Metal fusion bonding

Process

Applying or distributing fused filler

C427S455000, C427S192000

Reexamination Certificate

active

07900812

ABSTRACT:
A process for physically bonding two parts to each other is disclosed. In addition, a process for forming electrical connections have a low resistance is disclosed. The process is generally applicable to the joining of two parts each formed from a metal, an alloy, or a combination thereof. The process finds special use in the formation of multi-celled batteries. The process involves placing two parts or electrical conductors in contact with each other and then bonding them to each other using a kinetic spray process and powder particles. In formation of a multi-celled battery the particles are preferably electrically conductive. The process enables for rapid and cost effective formation of a physical connection. In addition, the connection can have an electrical resistance of less than about 0.5 milli Ohms and strength equal or greater than ultrasonic welding. The process has the advantage of being a low temperature process thereby lowering the risk of thermal damage to the parts or cells of a multi-cell battery during formation of the connection.

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