Second bond positioning wire bonder

Details Second bond positioning wire bonder Second bond positioning wire bonder

1976-08-17

1978-02-14

Kelly, Donald G.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

74471XY, 228 7, 228102, H01L 2160

Patent

active

040734242

ABSTRACT:
An apparatus for automatically positioning a wire bonding machine at a second bond position is provided with a plurality of individually adjustable second bond positioning devices set at second bond positions and cooperable with second bond positioning actuating means. After positioning a semiconductor at a first bond position and completing a first bond, the second bond actuating means cooperating with a second bond positioning device automatically moves the semiconductor to a second bond position. After completing the second bond, the second bond positioning actuating means is released permitting the semiconductor to return to a first bond position as another second bond positioning device is cycled into active position.

REFERENCES:
patent: 3149510 (1964-09-01), Kulicke, Jr.
patent: 3175820 (1965-03-01), Schiler
patent: 3773240 (1973-11-01), Heim

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