Sealing structure, method of soldering and process for preparing

Details Sealing structure, method of soldering and process for preparing Sealing structure, method of soldering and process for preparing

1987-06-18

1989-08-08

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228208, 22826312, 22826317, 22826316, 220 23R, B23K 103

Patent

active

048544957

ABSTRACT:
This invention discloses a method of soldering together at least two members selected form metals and ceramics, which comprises successively jointing a high-melting jointing material, a medium-melting jointing material, and a low-melting jointing material, and a sealing structure prepared by this method.
The method according to present invention enables the preparation of a sealing structure having a soldered area which is excellent in tightness.

REFERENCES:
patent: 3213532 (1985-10-01), Glaser et al.
patent: 3394451 (1968-07-01), Stuart
patent: 3473216 (1969-10-01), Webb
patent: 3893224 (1975-07-01), Besson
patent: 4602731 (1986-07-01), Dockus
patent: 4699310 (1987-10-01), Kohno et al.
patent: 4749118 (1988-06-01), Yokoi et al.

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