Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1995-07-21
1997-02-04
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257698, 257778, 257737, 257780, 257785, H01L 2348
Patent
active
056001800
ABSTRACT:
A sealing structure for bumps on a semiconductor integrated circuit chip to be bonded through the bumps onto a circuit board is provided wherein a plurality of pads are formed on the semiconductor integrated circuit chip. Each of the pads is formed with a bump thereon. A coating material is provided to coat at least surfaces of the above a plurality of bumps. The material is made of an insulation material having a hardness sufficiently small for showing, when bonding the chip onto the circuit board, a deformation thereby at least a top portion of each of the bumps is made contact with pads provided on the circuit board.
REFERENCES:
patent: 5283468 (1994-02-01), Kondo et al.
patent: 5461197 (1995-10-01), Hiruta et al.
Kusaka Teruo
Nishizawa Atsushi
Senba Naoji
Takahashi Nobuaki
Crane Sara W.
NEC Corporation
Potter Roy
LandOfFree
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