Sealing resin, resin-sealed semiconductor and system-in-package

Details Sealing resin, resin-sealed semiconductor and system-in-package Sealing resin, resin-sealed semiconductor and system-in-package

2005-01-18

2005-01-18

Zarneke, David A. (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified filler material

C257S788000

Reexamination Certificate

active

06844633

ABSTRACT:
Sealing resin comprising a resin component and filler mixed in the resin component, the filler having grain size distribution with a plurality of grain size peaks. The complex internal structure can be filled with the sealing resin including the filler particles with the plurality of the filler distribution peaks.

REFERENCES:
patent: 5498657 (1996-03-01), Sugiyama et al.
patent: 6165398 (2000-12-01), Matsumoto et al.
patent: RE37022 (2001-01-01), Sugiyama et al.
patent: 6300244 (2001-10-01), Itabashi et al.
patent: 1282105 (2001-01-01), None
patent: 56-010947 (1981-02-01), None
patent: 57-212225 (1982-12-01), None
patent: 62-261161 (1987-11-01), None
patent: 02-226615 (1990-09-01), None

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