Sealing resin composition for electronic component and electroni

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

523213, 524602, 524404, 524432, 524433, 524588, 524518, C08L 3100, C08L 7712, C08L 3318, C08J 3136

Patent

active

051108615

ABSTRACT:
A sealing resin composition is provided with is useful in the encapsulation of an electronic component and comprises a melt-processable polyester having a weight-average molecular weight of 1000 to 3900 and is capable of forming an optically anisotropic molten phase, and at most 80 percent by weight based upon the total weight of the composition of an inorganic powder which has been surface-treated with an epoxysilane or mercaptosilane coupling agent.

REFERENCES:
patent: 4626371 (1986-12-01), Ikenaga et al.
patent: 4639476 (1987-01-01), Tajiri et al.
patent: 4719250 (1988-01-01), Eickman et al.
patent: 4851497 (1989-07-01), Warui et al.
patent: 4861515 (1989-08-01), Minamisawa et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Sealing resin composition for electronic component and electroni does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sealing resin composition for electronic component and electroni, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sealing resin composition for electronic component and electroni will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1412877

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.