Sealing resin composition for electronic component and electroni

Details Sealing resin composition for electronic component and electroni Sealing resin composition for electronic component and electroni

1989-07-28

1992-05-05

Page, Thurman K.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

523213, 524602, 524404, 524432, 524433, 524588, 524518, C08L 3100, C08L 7712, C08L 3318, C08J 3136

Patent

active

051108615

ABSTRACT:
A sealing resin composition is provided with is useful in the encapsulation of an electronic component and comprises a melt-processable polyester having a weight-average molecular weight of 1000 to 3900 and is capable of forming an optically anisotropic molten phase, and at most 80 percent by weight based upon the total weight of the composition of an inorganic powder which has been surface-treated with an epoxysilane or mercaptosilane coupling agent.

REFERENCES:
patent: 4626371 (1986-12-01), Ikenaga et al.
patent: 4639476 (1987-01-01), Tajiri et al.
patent: 4719250 (1988-01-01), Eickman et al.
patent: 4851497 (1989-07-01), Warui et al.
patent: 4861515 (1989-08-01), Minamisawa et al.

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