Sealing porous dielectrics with silane coupling reagents

Details Sealing porous dielectrics with silane coupling reagents Sealing porous dielectrics with silane coupling reagents

2006-09-05

2008-11-25

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

C257S751000, C257S761000, C257SE21024, C257SE27117

Reexamination Certificate

active

07456490

ABSTRACT:
A method and structure for sealing porous dielectrics using silane coupling reagents is herein described. A sealant chain (silane coupling reagent) is formed from at least silicon, carbon, oxygen, and hydrogen and exposed to a porous dielectric material, wherein the sealant chain reacts with a second chain, that has at least oxygen and is present in the porous dielectric defining the pores, to form a continuous layer over the surface of the porous dielectric.

REFERENCES:
patent: 5117276 (1992-05-01), Thomas et al.
patent: 5641702 (1997-06-01), Imai et al.
patent: 5985739 (1999-11-01), Plettner et al.
patent: 6180496 (2001-01-01), Farrens et al.
patent: 6358863 (2002-03-01), Desu et al.
patent: 6864142 (2005-03-01), Conn
patent: 6902987 (2005-06-01), Tong et al.
patent: 6908832 (2005-06-01), Farrens et al.
patent: 6974762 (2005-12-01), Gracias et al.
patent: 7094441 (2006-08-01), Chittibabu et al.
patent: 2003/0036215 (2003-02-01), Reid

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