Sealing of integrated circuit modules

Details Sealing of integrated circuit modules Sealing of integrated circuit modules

1979-02-27

1980-11-11

Nielsen, Earl A.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

C-metal

260 37EP, 528 93, 528110, 357 72, 29589, H01L 2310

Patent

active

042336201

ABSTRACT:
The hermetic seal of the backside of a substrate of an integrated circuit module is provided by a composition containing about 51.4 to about 60.6% by weight of an epoxy polymer; about 39 to about 48% by weight of a hardener and flexibilizing portion; and up to about 0.6% by weight of a coloring agent.

REFERENCES:
patent: 3311589 (1967-03-01), Kohn et al.
patent: 3431237 (1969-03-01), Harry
patent: 3784583 (1974-01-01), Smith

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