Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-08-14
2007-08-14
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S603030, C029S837000, C310S071000
Reexamination Certificate
active
11498106
ABSTRACT:
The present invention provides a method for sealing a metal housing member. A housing through hole is formed in a housing member for a lead wire sealing device. The housing member is provided with a housing through hole formed on the metal housing member and penetrates from a closed space to an open space. A resin coating layer is formed to cover a lower surface of the housing member. A metal surface exposed part is formed on a part of the resin coating layer. The circuit board having a board aperture is mounted on the metal surface exposed part via an adhesive layer while overlapping with the board aperture on the housing through hole. The lead wire is inserted in the housing through hole and the board aperture that are overlapped with each other. The sealing material is provided on the circuit board to cover the board aperture.
REFERENCES:
patent: 4985793 (1991-01-01), Anderson
patent: 5454157 (1995-10-01), Ananth et al.
patent: 5672927 (1997-09-01), Viskochil
patent: 5986365 (1999-11-01), Kuwert et al.
patent: 6071014 (2000-06-01), Lee et al.
patent: 6556372 (2003-04-01), Hearn et al.
patent: 7119984 (2006-10-01), Macleod et al.
patent: 2661758 (1997-06-01), None
patent: 3373262 (2002-11-01), None
patent: 3373625 (2002-11-01), None
Ito Tokichi
Oku Yoshito
Watanabe Nobuaki
Yonei Hiroyuki
Nidec Corporation
Trinh Minh
Westerman Hattori Daniels & Adrian LLP
LandOfFree
Sealing method for through hole formed in metal housing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Sealing method for through hole formed in metal housing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sealing method for through hole formed in metal housing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3893984