Sealing label for sealing semiconductor element

Details Sealing label for sealing semiconductor element Sealing label for sealing semiconductor element

1997-11-26

2000-09-05

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Edge feature

428458, 428344, 257668, 257783, 257784, 257787, 257788, 257789, B32B 2302

Patent

active

061140139

ABSTRACT:
A sealing label for sealing semiconductor element comprises a metal foil substrate or a heat-resisting organic film substrate having formed thereon a sealing material component layer for sealing a semiconductor element, wherein the sealing material component layer is convexly formed such that the layer has a thick flat portion at the central portion of the substrate as compared with the peripheral portion of the substrate. The use of the sealing label in molding a semiconductor device can provide a semiconductor device having a high quality without substantially having voids in the sealing resin.

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patent: 6001951 (1999-12-01), Fukuoka et al.
patent: 6008311 (1998-10-01), Sakamoto et al.

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