Sealing glass compositions

Details Sealing glass compositions Sealing glass compositions

1980-01-02

1983-09-20

Bell, Mark

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 32, 501 76, C03C 312

Patent

active

044057229

ABSTRACT:
A sealing glass composition containing refractory filler of lower coefficient of thermal expansion for use in sealing alumina package for electronic components is disclosed. The composition consists essentially of low melting glass powder and cordierite powder in proportion of 2-30% by weight of the total composition, and optionally, .beta.-eucryptite, .beta.-spodumen, lead titanate or zircon in a proportion, respectively, not exceeding 15% by weight of the total composition. The low melting glass has a composition of 77.0-86.0 wt. % of PbO, 6.0-15.0 wt. % of B.sub.2 O.sub.3, 0.5-6.9 wt. % of ZnO, 0.1-3.0 wt. % of SiO.sub.2, 0-3.0% of Al.sub.2 O.sub.3 0-2.0% of alkali earth metal oxide, 0-1.5% of SnO.sub.2 and 0-1.0% of alkali metal oxide.

REFERENCES:
patent: 3951669 (1976-04-01), Malmendier et al.
patent: 4006028 (1977-02-01), Nofziger
patent: 4115132 (1978-09-01), Suzuki et al.
patent: 4133690 (1979-01-01), Muller
patent: 4186023 (1980-01-01), Dumesnil et al.
Forbes; "Solder Glass Seals in Semi-Conductor Packaging", Glass Technology, 8, 32 (1967) pp. 32-42.

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