Compositions: ceramic – Ceramic compositions – Glass compositions – compositions containing glass other than...
Patent
1987-04-09
1987-12-01
Bell, Mark L.
Compositions: ceramic
Ceramic compositions
Glass compositions, compositions containing glass other than...
501 17, 501 32, 501 75, 501 76, C03C 814, C03C 824, C03C 1400, C03C 3064
Patent
active
047104791
ABSTRACT:
A sealing glass composition suitable for sealing members in semiconductor devices at a temperature below about 450.degree. C. for a short time and a comparatively low thermal expansion coefficient of about 33-48.times.10.sup.-7 /.degree.C. matching with semiconductors. The sealing glass composition comprises 50-80 vol % solder glass powder and 20-50 vol % filler powder of lead calcium titanate represented by (Pb.sub.1-m Ca.sub.m)TiO.sub.3 where 0<m.ltoreq.0.4.
REFERENCES:
patent: 4115132 (1978-09-01), Suzuki et al.
patent: 4186023 (1980-01-01), Dumesnil et al.
patent: 4365021 (1982-12-01), Pirooz
patent: 4405722 (1983-09-01), Kokuba et al.
patent: 4415898 (1985-05-01), Davis et al.
Yamaguchi Fumio
Yamanaka Toshio
Bell Mark L.
Kelman Kurt
Nippon Electric Glass Company, Limited
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