Compositions: ceramic – Ceramic compositions – Glass compositions – compositions containing glass other than...
Patent
1989-04-05
1989-11-28
Bell, Mark L.
Compositions: ceramic
Ceramic compositions
Glass compositions, compositions containing glass other than...
501 17, 501 32, C03C 312
Patent
active
048837776
ABSTRACT:
A sealing glass composition suitable for sealing members in semiconductor devices at a temperature below about 450.degree. C. and a comparatively low thermal expansion coefficient of about 35-50.times.10.sup.-7 /.degree.C. matching that of semiconductors. The sealing glass composition comprises 50-80 vol % solder glass powder and 20-50 vol % filler powder of a ceramic comprising, by weight, PbO 65-75%, TiO.sub.2 10-25%, Fe.sub.2 O.sub.3 1-10%, WO.sub.3 1-12%, and CaO 0-5%, so that Ti in the PbTiO.sub.3 filler is partially substituted by Fe and W. The filler powder has an average particle size of about 5 .mu.m. In use of the sealing glass composition, microcracks are absent in glass phase around the filler after sealing.
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Bell Mark L.
Nippon Electric Glass Company, Limited
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