Sealing device and sealing device manufacturing method

Details Sealing device and sealing device manufacturing method Sealing device and sealing device manufacturing method

1996-06-28

1999-03-23

DePumpo, Daniel G.

Seal for a joint or juncture

Seal between relatively movable parts

Circumferential contact seal for other than piston

277549, 277572, 277575, 264138, 264268, F16J 906

Patent

active

058849190

ABSTRACT:
Handling ability can be improved and operational defect at a time of integral formation with a rubber like elastic seal lip can be prevented by effecting a chamfering working to an edge portion of a conical washer like resin ring. In a method in which a conical washer like resin ring 40 is formed by conically cutting away an end surface 51 of a cylindrically formed resin material 50 with a predetermined thickness and the resin ring is utilized as a seal lip 3 by assembling the inner diameter end portion or outer diameter end portion with a device body, it is characterized in that a sharply projecting edge portion 47 on the side utilizing as the seal lip of the conical washer like resin ring 40 is subjected to chamfering working 45, 46. It is characterized in that the resin ring 40 is assembled with the device body having a rubber like elastic seal lip 2.

REFERENCES:
patent: 4497496 (1985-02-01), Repella
patent: 4501431 (1985-02-01), Peisker et al.
patent: 4867926 (1989-09-01), Matsushima
patent: 5104603 (1992-04-01), Saitoh
patent: 5106565 (1992-04-01), Saito
patent: 5183271 (1993-02-01), Wada et al.
patent: 5183617 (1993-02-01), Saitoh
patent: 5213343 (1993-05-01), White, Jr.

Affiliated with

Also associated with

Rating

Sealing device and sealing device manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sealing device and sealing device manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sealing device and sealing device manufacturing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2118859