Sealing board and method for producing the same

Electricity: conductors and insulators – Boxes and housings – With electrical device

Reexamination Certificate

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C228S179100

Reexamination Certificate

active

07842891

ABSTRACT:
There is provided a sealing board (30) for sealing a container containing an electronic component, constituted of a base which is made of a material exhibiting a low wettability to a brazing filler metal (31) and on a surface of which a metal layer exhibiting a high wettability to the brazing filler metal (31) is formed, a brazing filler metal portion formed on the metal layer to form a closed region, and an exposed portion in which a surface of the base is exposed in at least a part of the closed region. By making at least a part of the sealing board as the exposed portion, it is possible to produce the sealing board with the brazing filler metal for a package stable in quality and inexpensively.

REFERENCES:
patent: 5494781 (1996-02-01), Ohtani et al.
patent: 2004/0188124 (2004-09-01), Stark
patent: 1103233 (1995-05-01), None
patent: 05-167377 (1993-07-01), None
patent: 2001-345394 (2001-12-01), None
patent: 2002-009186 (2002-01-01), None
patent: 2003-163298 (2003-06-01), None
patent: 2003-163299 (2003-06-01), None
patent: 2004-186428 (2004-07-01), None
Machine translation for JP 2004-186428 A translated on Feb. 9, 2010 (18 pages).
PCT First Notice Informing the Applicant of the Communication of the International Application (Form PCT/IB/308) dated Jan. 2004.
PCT Second and Supplementary Notice Informing the Applicant of the Communication of the International Application (Form PCT/IB/308) dated Jan. 2004.
Notification of the First Examination Report issued on Chinese Appln. No. 200680002722.4, “Sealing Board and Method for Producing the Same”, dated May 30, 2008, with English translation.

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