Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2010-09-14
2011-10-25
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S678000, C257S687000
Reexamination Certificate
active
08044507
ABSTRACT:
A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a tower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven surface in the area and a shock absorber under the lower mold.
REFERENCES:
patent: 5125821 (1992-06-01), Saeki et al.
patent: 5783134 (1998-07-01), Yabe et al.
patent: 5834035 (1998-11-01), Osada et al.
patent: 6081978 (2000-07-01), Utsumi et al.
patent: 6344162 (2002-02-01), Miyajima
patent: 6630374 (2003-10-01), Yamamoto
patent: 7800221 (2010-09-01), Matsumoto
patent: 2002/0030258 (2002-03-01), Fukasawa et al.
patent: 63-183824 (1988-07-01), None
patent: 01-127819 (1989-08-01), None
patent: 03-073454 (1991-07-01), None
patent: 07-211739 (1995-08-01), None
patent: 08-064725 (1996-03-01), None
patent: 9-219421 (1997-08-01), None
patent: 10-079362 (1998-03-01), None
patent: 10-125705 (1998-05-01), None
patent: 11-026642 (1999-01-01), None
patent: 11-077756 (1999-03-01), None
patent: 2000-021786 (2000-01-01), None
patent: 2000-058571 (2000-02-01), None
patent: 2000-133666 (2000-05-01), None
patent: 2000-299334 (2000-10-01), None
patent: 2000-299335 (2000-10-01), None
patent: 2000-349114 (2000-12-01), None
OKI Semiconductor Co., Ltd.
Pham Long
Rabin & Berdo P.C.
LandOfFree
Sealing apparatus for semiconductor wafer, mold of sealing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Sealing apparatus for semiconductor wafer, mold of sealing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sealing apparatus for semiconductor wafer, mold of sealing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4271258