Sealing apparatus for semiconductor wafer, mold of sealing...

Details Sealing apparatus for semiconductor wafer, mold of sealing... Sealing apparatus for semiconductor wafer, mold of sealing...

2007-12-18

2007-12-18

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S678000, C257S687000

Reexamination Certificate

active

10727662

ABSTRACT:
A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven surface in the area and a shock absorber under the lower mold.

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