Sealing and thermal accommodation arrangement in LED...

Details Sealing and thermal accommodation arrangement in LED... Sealing and thermal accommodation arrangement in LED...

2011-07-12

2011-07-12

May, Robert (Department: 2885)

Illumination

Light source and modifier

Plural serial lens elements or components

C362S267000, C362S331000, C362S326000, C362S319000

Reexamination Certificate

active

07976194

ABSTRACT:
An LED apparatus of the type having a mounting board, an LED package thereon with a primary lens, and a secondary lens member over the primary lens and establishing a light path therebetween, includes a resilient member against the secondary lens member in position other than in the light path, the resilient member yieldingly constraining the secondary lens member and accommodating secondary lens member movement caused by primary lens thermal expansion during operation.

REFERENCES:
patent: 5066889 (1991-11-01), Edwards
patent: 5617131 (1997-04-01), Murano et al.
patent: 5848839 (1998-12-01), Savage, Jr.
patent: 6999318 (2006-02-01), Newby
patent: 2004/0052077 (2004-03-01), Shih
patent: 2004/0076003 (2004-04-01), Collura et al.
patent: 2004/0160782 (2004-08-01), Zimmermann et al.
patent: 2005/0013139 (2005-01-01), Sugihara et al.
patent: 2007/0070618 (2007-03-01), Talamo et al.
patent: 2007/0076433 (2007-04-01), Kinoshita et al.
patent: 2007/0201225 (2007-08-01), Holder et al.
patent: 2007/0274084 (2007-11-01), Kan et al.
patent: 2008/0089060 (2008-04-01), Kondo et al.
patent: 2008/0198606 (2008-08-01), Goto
patent: 2008/0239704 (2008-10-01), Lin
patent: 2008/0239724 (2008-10-01), Moriyama et al.
patent: 2008/0266852 (2008-10-01), Valerio et al.

Affiliated with

Also associated with

Rating

Sealing and thermal accommodation arrangement in LED... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sealing and thermal accommodation arrangement in LED..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sealing and thermal accommodation arrangement in LED... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2630974