Sealed-type liquid cooling device with expandable bellow for sem

Details Sealed-type liquid cooling device with expandable bellow for sem Sealed-type liquid cooling device with expandable bellow for sem

1986-03-25

1988-04-26

Scott, J. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 82, 165 804, H05K 720

Patent

active

047408669

ABSTRACT:
A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion and is combined with a semiconductor chip through the electrical insulating layer; and a bellows which is connected between the housing and the cooling block. The cooling fluid is supplied to the cooling block through the bellows. The bellows is formed in a manner such that a plurality of substantially plane ring-like metal plates are laminated, pressed, diffused, joined, and thereafter stretched and molded.

REFERENCES:
patent: 3653690 (1972-04-01), Treveiler et al.
patent: 3796103 (1974-03-01), Winfield, Jr.
patent: 4484772 (1984-11-01), Ross, Jr. et al.

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