Sealed semiconductor device with protruding portion

Details Sealed semiconductor device with protruding portion Sealed semiconductor device with protruding portion

1991-10-09

1993-09-07

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257729, 257787, 361773, H01L 2328

Patent

active

052432173

ABSTRACT:
A sealed semiconductor device, comprising at least one semiconductor chip, a wiring circuit board having the at least one semiconductor chip disposed thereon, at least one inner wire connecting the semiconductor chip to the wiring circuit board, a base board having the wiring circuit board disposed thereon, the base board enclosed on all sides forming a case, a silicon gel layer partially filling the case, a sealing resin layer disposed within the case above the silicon gel layer, a resin block in contact with the sealing resin layer, at least one inner terminal portion electrically connected to the wiring circuit board, at least one intermediate protruding portion electrically connected to, and projecting upwardly from, the at least one inner terminal portion, at least one aperture through the at least one intermediate protruding portion, the at least one aperture substantially disposed along a direction of a current passing through the at least one intermediate protruding portion within the case, and an outer terminal portion electrically connected to the at least one intermediate protruding portion is disclosed.

REFERENCES:
patent: 4532539 (1985-06-01), Frister
patent: 4558510 (1985-12-01), Tani et al.
patent: 4825279 (1989-04-01), Furuhata
patent: 4987474 (1991-01-01), Yasuhara et al.

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