Sealed semiconductor containing an epoxy resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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Details

525109, 525111, 525113, 525119, 525122, C08K 0334, C08K 0326, C08L 6302, C08L 6304

Patent

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047866756

ABSTRACT:
For use in sealing semiconductors, an epoxy resin composition is provided which comprises an epoxy resin, a curing agent, a filler and a modifier, wherein the modifier is a diene polymer or acrylic polymer having an iodine number of not more than 120 or both included in an amount of 1 to 50 parts by weight per 100 parts by weight of the epoxy resin.

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