Sealed semiconductor casing

Details Sealed semiconductor casing Sealed semiconductor casing

1985-02-01

1989-12-26

Grimley, A. T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 5061, 428433, 501 44, H01L 2308

Patent

active

048899607

ABSTRACT:
Reinforced glass composites are disclosed which are useful in hermetic semiconductor packaging as well as other applications. The disclosed composites include discrete particles in a tin-phosphorous-oxyfluoride glass mixture having a low glass transition temperature to prevent serious degradation of the discrete particles.

REFERENCES:
patent: 3871018 (1975-03-01), Jackson et al.
patent: 4178411 (1979-12-01), Cole et al.
patent: 4268562 (1981-05-01), Bacon et al.
patent: 4314031 (1982-02-01), Sanford et al.
patent: 4314852 (1982-02-01), Brennan et al.
patent: 4341840 (1982-07-01), Prewo
patent: 4379070 (1983-04-01), Tick
patent: 4461924 (1984-07-01), Butt

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